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Volumn 144, Issue 1, 2004, Pages 13-19

Electroconductive adhesives based on epoxy and polyurethane resins filled with silver-coated inorganic fillers

Author keywords

Antistatic properties; Discharging characteristics; Electrical conductivity; Electrically conductive adhesives; Impact strength; Percolation concentration; Silver coated inorganic particles and fibers; Strength of adhesive joint

Indexed keywords

ALUMINUM; COMPOSITE MATERIALS; COMPUTER SOFTWARE; CROSSLINKING; ELECTRIC CONDUCTIVITY; ELECTRIC FIELDS; FILLERS; PERCOLATION (COMPUTER STORAGE); PLASTIC ADHESIVES; POLYURETHANES; SCANNING ELECTRON MICROSCOPY;

EID: 2342477715     PISSN: 03796779     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.synthmet.2004.01.001     Document Type: Article
Times cited : (66)

References (23)
  • 13
    • 0034824335 scopus 로고    scopus 로고
    • A.I. Nakatani, R.P. Hjelm, M. Gerspacher, R. Krishnamoorti (Eds.), MRS, Warrendale
    • V. Bouda, J. Chladek, Filled and Nanocomposite Polymer Materials, in: A.I. Nakatani, R.P. Hjelm, M. Gerspacher, R. Krishnamoorti (Eds.), MRS, Warrendale, 2001, KK 5.17.
    • (2001) Filled and Nanocomposite Polymer Materials
    • Bouda, V.1    Chladek, J.2


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.