Thermodynamic properties of the liquid Bi-Cu-Sn Lead-free solder alloys

Journal of Mining and Metallurgy, Section B: Metallurgy

Volumn 45, Issue 1, 2009, Pages 95-100

  Kopyto, M ^a   Garzel, G ^a   Zabdyr, L A ^a  

^a INSTITUTE OF METALLURGY AND MATERIALS SCIENCE   (Poland)

Author keywords

Electrochemical techniques; Lead free solders; Thermodynamic properties

Indexed keywords

EID: 77953785082     PISSN: 14505339     EISSN: None     Source Type: Journal    
DOI: 10.2298/JMMB0901095K     Document Type: Article

References (3)

1. H. Flandorfer, A. Sabbar, C. Luef, M. Rechchach, H. Ipser, Thermochimica Acta, 472 (1-2) (2008) 1.
2. M. Kopyto, B. Onderka, L. A. Zabdyr, Thermodynamic properties of the liquid Ag-Cu-Sn lead-free alloys, (submitted to Materials Chemistry and Physics)
3. D.Manasijević, D.Minić, D.Živković, J.Vreštal, N.Talijan, A.Grujić, S.Marjanović, Experimental study and thermodynamic prediction of Bi-Cu-Sn system phase equilibria, COST Action MP0602 Joint Working Group Meeting in Genova, Feb 21-22 2008, Proceedings. p.29.