Surface tension of the 60%Bi-24%Cu-16%Sn alloy and the critical temperature of the immiscible liquid phase separation

Materials Letters

Volumn 62, Issue 29, 2008, Pages 4464-4466

  Min, Soonki ^a   Park, Joongchul ^a   Lee, Joonho ^a  

^a Korea University   (South Korea)

Author keywords

Alloy; Characterization method; Critical temperature; Solder; Surface tension; Surfaces

Indexed keywords

CAPILLARITY; COPPER; COPPER ALLOYS; ISOMERS; LEAD; LIQUIDS; PHASE MODULATION; SEPARATION; SURFACE CHEMISTRY; SURFACE PROPERTIES; SURFACE TENSION; SURFACE WAVES; TEMPERATURE DISTRIBUTION; TIN; TIN ALLOYS; WETTING;

ALLOY; CHARACTERIZATION METHOD; CRITICAL TEMPERATURE; SOLDER; SURFACES;

PHASE SEPARATION;

EID: 51349161574     PISSN: 0167577X     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.matlet.2008.08.007     Document Type: Article

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