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Volumn 472, Issue 1-2, 2008, Pages 1-10
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Enthalpies of mixing of liquid Bi-Cu and Bi-Cu-Sn alloys relevant for lead-free soldering
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Author keywords
Bi Cu; Bi Cu Sn; Calorimetry; Enthalpy of mixing; Lead free solders; Liquid alloys
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Indexed keywords
CALORIMETRY;
ENTHALPY;
MATHEMATICAL MODELS;
POLYNOMIALS;
SOLDERING;
TERNARY ALLOYS;
ENTHALPY OF MIXING;
LEAD-FREE SOLDERS;
LIQUID ALLOYS;
REDLICH-KISTER-MUGGIANU MODEL;
BINARY MIXTURES;
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EID: 44349132686
PISSN: 00406031
EISSN: None
Source Type: Journal
DOI: 10.1016/j.tca.2008.02.023 Document Type: Article |
Times cited : (12)
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References (39)
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