Patterning with amorphous carbon thin films

ECS Transactions

Volumn 35, Issue 4, 2011, Pages 701-716

  Antonelli, G A ^a   Reddy, S ^b   Subramonium, P ^b   Henri, J ^b   Sims, J ^b   O'Loughlin, J ^b   Shamma, N ^c   Schlosser, D ^c   Mountsier, T ^c   Guo, W ^d   Sawin, H ^d  

^a External Research and Development   (United States)

^b Novellus Systems Inc   (United States)

^c NOVELLUS SYSTEMS INC   (United States)

^d Massachusetts Institute of Technology Cambridge   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

AMORPHOUS CARBON; CARBON FILMS; DIELECTRIC MATERIALS; ION BOMBARDMENT; PLASMA CVD; PLASMA ENHANCED CHEMICAL VAPOR DEPOSITION; SILICA; SILICON NITRIDE; TRANSPARENCY;

AMORPHOUS CARBON THIN FILMS; DEPOSITION PROCESS; DIELECTRIC ETCHES; ELASTIC INSTABILITIES; ENABLING TECHNOLOGIES; FRONT END OF LINES; HIGH TRANSPARENCY; LITHOGRAPHY ALIGNMENTS;

THIN FILMS;

EID: 79960886422     PISSN: 19385862     EISSN: 19386737     Source Type: Conference Proceeding    
DOI: 10.1149/1.3572314     Document Type: Conference Paper

References (21)

1. K.A. Pears, M. Stavrev, A. Scire, R. Koepe, M. Markert, U. Egger, and L. Donohue, Microelectron. Eng., 81, 156 (2005).
2. K. Ronse, Microelectron. Eng., 67-68, 300 (2003).
3. H.B. Cao, W.D. Domke, and P.F. Nealey, J. Vac. Sci. Technol. B, 18, 3303 (2000).
4. W. Von Bolton, Electrochem., 17, 971 (1911).
5. H. Schmellenmeier, Phys. Chem., 35, 17 (1955).
6. C.V. Deshpandey and R. F. Bunshah, J. Vac. Sci. Technol. A, 7, 2294 (1989).
7. J. Robertson, Mat. Sci. Eng. R., 37, 129 (2002).
8. A.C. Ferrari and J. Robertson, Phys. Rev. B, 61, 14095 (2000).
9. F. Tuinstra and J.L Koenig, J. Chem. Phys., 53, 1126 (1970).
10. Y. Yin and H.H. Sawin, J. Vac. Sci. Technol. A, 25, 802 (2007).
11. J.W. Cobum and H.F. Winters, J. Vac. Sci. Technol., 16, 391 (1979).
12. A.E. Andrew, E.H. Hasseltine, N.T. Olson, and H.P. Smith, J. Appl. Phys., 37, 3344 (1966).
13. H.F. Winters, J.W. Coburn, and T.J. Chuang, J. Vac. Sci. Technol. B, 1, 469 (1983).
14. S. Rasgon, PhD thesis, MIT (2004).
15. R.M. Bradley and J.M.E. Harper, J. Vac. Sci. Technol. A, 6, 2390 (1988).
16. E.O. Yewande, A.K. Hartmann, and R. Kree, Phys. Rev. B, 71, 195405 (2005).
17. S. Rusponi, G. Costantini, C. Boragno, and U. Valbusa, Phys. Rev. Lett., 81, 2735 (1998).
18. L.B Freund and S. Suresh, Thin Films Materials: Stress, Defect Formation and Surface Evolution, p. 312, Cambridge University Press, Cambridge (2003).
19. X.D. Zhu, K. Narumi and H. Naramoto, J. Phys.: Condens. Matter, 19, 236227 (2007).
20. M. Damon, T. Chevolleau, O. Joubert, S. Maitrejean, J.C. Barbe, and J. Torres, Appl. Phys. Lett., 91, 194103 (2007).
21. T. Chevolleau, N. Posseme, T. David, R. Bouyssou, J. Ducote, F. Bailly, M. Damon, M. El Kodadi, M. Besacier, C. Licitra, M. Guillermet, A. Ostrovsky, C. Verove, and O' Joubert, Proc. IITC 2010, 1 (2010).