Temporary bonding of wafer to carrier for 3D-wafer level packaging

10th Electronics Packaging Technology Conference, EPTC 2008

Volumn , Issue , 2008, Pages 405-411

  Shuangwu, Mark Huang ^a   Pang, David Li Wai ^a   Nathapong, Suthiwongsunthorn ^a   Marimuthu, Pandi ^a  

^a STATS CHIPPAC LTD   (Singapore)

Author keywords

[No Author keywords available]

Indexed keywords

CHEMICAL ATTACK; CHIP SCALE PACKAGES; CRACKING (CHEMICAL); DEBONDING; ELECTRONIC EQUIPMENT MANUFACTURE; GLASS; GLASS BONDING; GRINDING (MACHINING); MICROELECTRONICS; PLASMA ENHANCED CHEMICAL VAPOR DEPOSITION; SEMICONDUCTING SILICON COMPOUNDS; SILICON COMPOUNDS; SILICON WAFERS; STEEL SHEET; SUBSTRATES;

BACKGRINDING; BONDING ADHESIVES; BONDING AGENTS; BONDING DEFECTS; BONDING MATERIALS; CARRIER SUBSTRATES; CARRIER WAFERS; CURRENT PRACTICES; DEVICE WAFERS; GLASS WAFERS; HIGH-PERFORMANCE PACKAGES; PLASMA ETCH; POWER APPLICATIONS; REFLOW PROCESS; ROOT CAUSE; SYSTEM-IN-PACKAGING; TEMPORARY MATERIALS; THERMAL BEHAVIORS; THICKNESS VARIATIONS; THROUGH-SILICON VIAS; THROUGH-SILICON-VIA; UV- ANDS; WAFER-LEVEL PACKAGING;

WAFER BONDING;

EID: 63049137604     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/EPTC.2008.4763468     Document Type: Conference Paper

References (11)

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