Reliability of 20μm micro bump interconnects

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2011, Pages 608-611

  You, Ha Young ^a   Lee, Yoon Soo ^a   Lee, Sang Keun ^a   Kang, Ju Seong ^a  

^a SAMSUNG Electronics   (South Korea)

Author keywords

[No Author keywords available]

Indexed keywords

DISSOLUTION RATES; EM RESISTANCE; FINE PITCH; MICRO-BUMPS; RELIABILITY EVALUATION; TIME TO FAILURE;

DISSOLUTION; TIN;

RELIABILITY;

EID: 79960421319     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.2011.5898575     Document Type: Conference Paper

References (12)

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