Hot embossing of micro and sub-micro structured inserts for polymer replication

Microsystem Technologies

Volumn 17, Issue 4, 2011, Pages 609-618

  Kolew, Alexander ^a   Münch, Daniel ^a   Sikora, Karsten ^a   Worgull, Matthias ^a  

^a KARLSRUHE INSTITUTE OF TECHNOLOGY   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

DEMOLDING; HIGH FLEXIBILITY; HIGH PERFORMANCE POLYMER; HOT-EMBOSSING; LONG TIME STABILITIES; MATERIAL COMBINATION; MOLD INSERTS; NANO METER RANGE; POLYMER REPLICATION; POLYMER STRUCTURE; PRODUCTION RATES; REPLICATION PROCESS; STATE OF THE ART; THERMOPLASTIC POLYMER;

DIE CASTING INSERTS; INJECTION MOLDING; MOLDS; REINFORCED PLASTICS;

POLYMERS;

EID: 79958803257     PISSN: 09467076     EISSN: None     Source Type: Journal    
DOI: 10.1007/s00542-010-1182-x     Document Type: Conference Paper

References (10)

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