Multiaxial creep-fatigue of 63Sn-37Pb solder at elevated temperature

Zairyo/Journal of the Society of Materials Science, Japan

Volumn 46, Issue 8, 1997, Pages 969-975

  Yamamoto, Takaei ^a   Sakane, Masao ^a   Ohnami, Masateru ^a   Tsukada, Yutaka ^b   Nishimura, Hideo ^b  

^a RITSUMEIKAN UNIVERSITY   (Japan)

^b IBM JAPAN LTD   (Japan)

Author keywords

Crack propagation; Creep fatigue; Multiaxial strain parameter; Multiaxial stress; Solder

Indexed keywords

CRACK PROPAGATION; CREEP; FATIGUE OF MATERIALS; MECHANICAL TESTING; PLASTIC DEFORMATION; SHEAR STRESS; TIN ALLOYS;

MICRO RACHET DEFORMATION; MULTIAXIAL STRESS; TIN LEAD ALLOYS;

SOLDERING ALLOYS;

EID: 0031200367     PISSN: 05145163     EISSN: None     Source Type: Journal    
DOI: 10.2472/jsms.46.969     Document Type: Article

References (7)

1. M. Pecht, A. Dasgupta, J. W. Evans and J. Y. Evans, ed., "Quality Conformance and Qualification of Microelectronic Packages and Interconnects" (1994) John Wiley & Sons, Inc..
2. T. Itoh, M. Sakane and M. Ohnami, Trans. ASME, JEMT, 116, 90 (1994)