Investigation of the mechanism of nickel electroless deposition on functionalized self-assembled monolayers

Langmuir

Volumn 27, Issue 11, 2011, Pages 6932-6939

  Shi, Zhiwei ^a   Walker, Amy V ^a  

^a The University of Texas at Dallas   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CARBOXYLATE COMPLEXES; COMPLEXING AGENTS; COOH-TERMINAL; DEPOSITION TEMPERATURES; DIMETHYLAMINE BORANES; ELECTROLESS DEPOSITION; FUNCTIONALIZED; METAL DEPOSITION; NUCLEATION SITES; ORGANIC THIN FILMS; REDUCTANTS; SAMS; SCANNING ELECTRONS; SURFACE COMPLEX; TERMINAL GROUPS; TIME OF FLIGHT SECONDARY ION MASS SPECTROMETRY;

CARBOXYLATION; COMPLEXATION; IONS; OPTICAL MICROSCOPY; PHOTOELECTRON SPECTROSCOPY; PHYSICAL VAPOR DEPOSITION; SECONDARY ION MASS SPECTROMETRY; SELF ASSEMBLED MONOLAYERS; X RAY PHOTOELECTRON SPECTROSCOPY;

DEPOSITION;

EID: 79958007928     PISSN: 07437463     EISSN: 15205827     Source Type: Journal    
DOI: 10.1021/la2012843     Document Type: Article

References (55)

1. Domenech, S. C.; Lima, E.; Drago, V.; De Lima, J. C.; Borges, N. G.; Avila, A. O. V.; Soldi, V. Appl. Surf. Sci. 2003, 220 (1-4) 238-250
2. Wang, T. C.; Chen, B.; Rubner, M. F.; Cohen, R. E. Langmuir 2001, 17, 6610-6615
3. Duffek, E. F.; Baudrand, D. W.; Donaldson, J. G. Electronic Applications of Electroless Nickel. In Electroless Plating: Fundamentals and Applications; Mallory, G. O.; Hajdu, J. B., Eds.; Noyes Publications/ William Andrew Publishing, LLC: Norwich, NY, 1990; pp 229-259.
4. Colaruotolo, J.; Tramontana, D. Engineering Applications of Electroless Nickel. In Electroless Plating: Fundamentals and Applications; Mallory, G. O.; Hajdu, J. B., Eds.; Noyes Publications/ William Andrew Publishing, LLC: Norwich, NY, 1990; pp 207-227.
5. Zhao, Q.; Liu, Y. J. Food Eng. 2006, 72 (3) 266-272
6. Bébin, P.; Prud'homme, R. E. Chem. Mater. 2003, 15, 965-973
7. Herdt, G. C.; Czanderna, A. W. J. Vac. Sci. Technol. A 1999, 17, 3415-3418
8. Herdt, G. C.; Jung, D. R.; Czanderna, A. W. Prog. Surf. Sci. 1995, 50, 103-129
9. Jung, D. R.; Czanderna, A. W.; Herdt, G. C. J. Vac. Sci. Technol. A 1996, 14, 1779-1787
10. Jung, D. R.; Czanderna, A. W. Crit. Rev. Solid State 1994, 19, 1-54
11. Galasso, F. S., Other CVD Materials. In Chemical Vapor Deposited Materials, CRC Press: Boca Raton, FL, 1991; pp 109-142.
12. Bensebaa, F.; Ellis, T. H.; Badia, A.; Lennox, R. B. J. Vac. Sci. Technol., A 1995, 13, 1331-1336
13. Schreiber, F. Prog. Surf. Sci. 2000, 65, 151-256
14. Schlesinger, M.; Paunovic, M. Modern Electroplating, 4 th ed.; John Wiley & Sons: New York, 2000.
15. Mallory, G. O.; Hajdu, J. B. Electroless Plating: Fundamentals and Applications; Noyes Publications/ William Andrew Publishing, LLC: Norwich, NY, 1990.
16. Lu, P.; Walker, A. V. Langmuir 2007, 23, 12577-12582
17. Schlesinger, M. Electroless Deposition of Nickel. In Modern Electroplating, 4 th ed.; Schlesinger, M.; Paunovic, M., Eds.; John Wiley & Sons: New York, 2000; pp 667-684.
18. Baetzold, R. C.; Mack, R. E. J. Catal. 1975, 37, 251-257
19. Lee, I.; Hammond, P. T.; Rubner, M. F. Chem. Mater. 2003, 15, 4583-4589
20. Pinto, N. J.; Carrión, P.; Quiñones, J. X. Mater. Sci. Eng., A 2004, 366, 1-5
21. Zhang, M. C.; Kang, E. T.; Neoh, K. G.; Tan, K. L. J. Electrochem. Soc. 2001, 148 (2) C71-C80
22. Dressick, W. J.; Chen, M.-S.; Brandow, S. L.; Rhee, K. W.; Shirey, L. M.; Perkins, F. K. Appl. Phys. Lett. 2001, 78, 676-678
23. Chen, M. S.; Brandow, S. L.; Schull, T. L.; Chrisey, D. B.; Dressick, W. J. Adv. Funct. Mater. 2005, 15 (8) 1364-1375
24. Chen, M.-S.; Brandow, S. L.; Dulcey, C. S.; Dressick, W. J.; Taylor, G. N.; Bohland, J. F.; Georger, J. H., Jr.; Pavelchek, E. K.; Calvert, J. M. J. Electrochem. Soc. 1999, 146 (4) 1421-1430
25. Maynor, B. W.; Li, Y.; Liu, J. Langmuir 2001, 17, 2575-2578
26. Liu, S.; Maoz, R.; Sagiv, J. Nano Lett. 2004, 4, 845-851
27. Liu, S.; Maoz, R.; Schmid, G.; Sagiv, J. Nano Lett. 2002, 2, 1055-1060
28. Li, Q.; Zheng, J.; Liu, Z. Langmuir 2003, 19, 166-171
29. Garno, J. C.; Yang, Y.; Amro, N. A.; Cruchon-Dupeyrat, S.; Chen, S.; Liu, G.-Y. Nano Lett. 2003, 3, 389-395
30. Dressick, W. J.; Dulcey, C. S.; Georger, J. H., Jr.; Calvert, J. M. Chem. Mater. 1993, 5, 148-150
31. Zangmeister, C. D.; van Zee, R. D. Langmuir 2003, 19, 8065-8068
32. Ulman, A. Self-Assembled Monolayers. In Characterization of Organic Thin Films; Ulman, A.; Fitzpatrick, L. E., Eds.; Butterworth-Heinemann Manning: Boston, 1995; pp 21-31.
33. Ulman, A. Chem. Rev. 1996, 96, 1533-1554
34. Love, J. C.; Estroff, L. A.; Kriebel, J. K.; Nuzzo, R. G.; Whitesides, G. M. Chem. Rev. 2005, 105, 1103-1169
35. Bain, C. D.; Troughton, E. B.; Tao, Y.-T.; Evall, J.; Whitesides, G. M.; Nuzzo, R. G. J. Am. Chem. Soc. 1989, 111, 321-335
36. Fisher, G. L.; Walker, A. V.; Hooper, A. E.; Tighe, T. B.; Bahnck, K. B.; Skriba, H. T.; Reinard, M. D.; Haynie, B. C.; Opila, R. L.; Winograd, N.; Allar, D. L. J. Am. Chem. Soc. 2002, 124, 5528-5541
37. Nuzzo, R. G.; Allara, D. L. J. Am. Chem. Soc. 1983, 105, 4481-4483
38. Nuzzo, R. G.; Dubois, L. H.; Allara, D. L. J. Am. Chem. Soc. 1990, 112, 558-569
39. Zhou, C.; Walker, A. V. Langmuir 2006, 22, 11420-11425
40. Vickerman, J. C.; Briggs, D. TOF-SIMS: Surface Analysis by Mass Spectrometry; IM Publications/Surface Spectra: Chichester, U.K., 2001.
41. Nagy, G.; Walker, A. V. J. Phys. Chem. B 2006, 110, 12543-12554
42. Andersen, C. A.; Hinthorne, J. R. Anal. Chem. 1973, 45 (8) 1421-1438
43. Cornelio, P. A.; Gardella, J. A., Jr. ACS Symp. Ser. 1990, 440, 379-393
44. Van Den Meerakker, J. E. A. M. J. Appl. Electrochem. 1981, 11, 395-400
45. Lelental, M. J. Electrochem. Soc. 1975, 122, 486-487
46. Mallory, G. O. The Electroless Nickel Plating Bath: Effect of Variables on the Process. In Electroless Plating: Fundamentals and Applications; Mallory, G. O.; Hajdu, J. B., Eds.; Noyes Publications/William Andrew Publishing, LLC: Norwich, NY, 1990; pp 57-99.
47. Mallory, G. O. The Fundamental Aspects of Electroless Nickel Plating. In Electroless Plating: Fundamentals and Applications; Mallory, G. O.; Hajdu, J. B., Eds.; Noyes Publications/William Andrew Publishing, LLC: Norwich, NY, 1990; pp 1-56.
48. Kanicky, J. R.; Shah, D. O. J. Colloid Interface Sci. 2002, 256, 201-207
49. Sillén, L. G.; Martell, A. E. Stability Constants of Metal-Ion complexes; The Chemical Society: London, 1964.
50. Lelental, M. J. Electrochem. Soc. 1973, 120, 1650-1654
51. Gordon, A. J.; Ford, R. A. The Chemist's Companion; John & Wiley Sons: New York, 1972.
52. Hooper, A.; Fisher, G. L.; Konstadinidis, K.; Jung, D.; Nguyen, H.; Opila, R.; Collins, R. W.; Winograd, N.; Allara, D. L. J. Am. Chem. Soc. 1999, 121, 8052-8064
53. Walker, A. V. Langmuir 2010, 26, 13778-13785
54. Martell, A. E.; Smith, R. M. Critical Stability Constants; Plenum Press: New York, 1974; Vol. 3, pp 1-12.
55. Martell, A. E.; Smith, R. M. Critical Stability Constants; Plenum Press: New York, 1974; Vol. 1, pp 204-211.