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Volumn 7969, Issue , 2011, Pages

EUV lithography at chipmakers has started: Performance validation of ASML's NXE:3100

Author keywords

EUV lithography; imaging; masks; resist; Sn source

Indexed keywords

BELGIUM; BUILDING BLOCKES; CHIPMAKERS; DEVICE VERIFICATION; EUV LITHOGRAPHY; EXPOSURE TOOL; HIGH VOLUME MANUFACTURING; IMAGING; IMAGING PERFORMANCE; INTEGRATION PHASE; KEY ELEMENTS; MANUFACTURING FLOW; MODULE PERFORMANCE; NEW YORK , USA; OFF-AXIS ILLUMINATION; PERFORMANCE VALIDATION; PLATFORM CONCEPT; PROCESS INTEGRATION; PRODUCTIVITY PERFORMANCE; RESIST; SEMICONDUCTOR MANUFACTURERS; SINGLE EXPOSURE; SN SOURCE; SOLID VOLUMES;

EID: 79957954525     PISSN: 0277786X     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1117/12.878603     Document Type: Conference Paper
Times cited : (52)

References (8)
  • 7
    • 79957955603 scopus 로고    scopus 로고
    • Tin DPP source collector module (SoCoMo) ready for integration into Beta scanner
    • M. Yoshioka, et al., "Tin DPP source collector module (SoCoMo) ready for integration into Beta scanner", SPIE Symposium on Extreme Ultraviolet (EUV) Lithography II, 7969 (2011)
    • (2011) SPIE Symposium on Extreme Ultraviolet (EUV) Lithography , vol.2 , pp. 7969
    • Yoshioka, M.1


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.