Effect of ultrasonication medium on the properties of copper nanoparticle-filled epoxy composite for electrical conductive adhesive (ECA) application

Journal of Materials Science: Materials in Electronics

Volumn 21, Issue 8, 2010, Pages 772-778

  Chan, K L ^a   Mariatti, M ^a   Lockman, Z ^a   Sim, L C ^b  

^a SCHOOL OF MATERIALS AND MINERAL RESOURCES ENGINEERING   (Malaysia)

^b Intel Technology Malaysia Sdn Bhd   (Malaysia)

Author keywords

[No Author keywords available]

Indexed keywords

AIR; CHLORINE COMPOUNDS; FILLED POLYMERS; HYBRID MATERIALS; METAL NANOPARTICLES; NANOCOMPOSITES; THERMODYNAMIC PROPERTIES; THERMOGRAVIMETRIC ANALYSIS;

CHLOROFORM SOLUTIONS; COPPER NANOPARTICLES; ELECTRICAL CONDUCTIVE ADHESIVES; EPOXY NANOCOMPOSITES; FILLER DISTRIBUTION; HIGH ELECTRICAL CONDUCTIVITY; LOW COEFFICIENT OF THERMAL EXPANSIONS; MICROSCOPIC OBSERVATIONS;

ELECTRIC PROPERTIES;

EID: 78650690192     PISSN: 09574522     EISSN: 1573482X     Source Type: Journal    
DOI: 10.1007/s10854-009-9991-3     Document Type: Article

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