Thermocouple attachment using epoxy in electronic system thermal measurements - A numerical experiment

Annual IEEE Semiconductor Thermal Measurement and Management Symposium

Volumn , Issue , 2011, Pages 280-291

  He, Qinghong ^a   Smith, Shane ^a   Xiong, Guohua ^b  

^a JABIL CIRCUIT INC   (United States)

^b Network Appliance Inc   (United States)

Author keywords

epoxy attachment; temperature measurement error; Thermocouple; thermocouple attachment

Indexed keywords

ELECTRONIC COMPONENT; ELECTRONIC SYSTEMS; EPOXY ATTACHMENT; EPOXY MATERIAL; MEASUREMENT RESULTS; NUMERICAL EXPERIMENTS; SEVERAL VARIABLES; THERMAL DESIGNS; THERMAL ENGINEERS; THERMAL MEASUREMENTS; THERMAL MODEL; THERMOCOUPLE MEASUREMENTS; TWO PARAMETER;

EXPERIMENTS; MEASUREMENT ERRORS; MEASUREMENTS; POTENTIAL FLOW; TEMPERATURE MEASUREMENT;

THERMOCOUPLES;

EID: 79957638655     PISSN: 10652221     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/STHERM.2011.5767212     Document Type: Conference Paper

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