An adaptable compact thermal model for BGA packages

Proceedings of 4th Electronics Packaging Technology Conference, EPTC 2002

Volumn , Issue , 2002, Pages 304-311

  Xie, Ming ^a   Toh, Kok Chuan ^a   Pinjala, D ^b  

^a NANYANG TECHNOLOGICAL UNIVERSITY   (Singapore)

^b INSTITUTE OF MICROELECTRONICS   (Singapore)

Author keywords

[No Author keywords available]

Indexed keywords

BALL GRID ARRAYS; ELECTRONICS PACKAGING; HEAT FLUX; HEAT TRANSFER; JOINTS (STRUCTURAL COMPONENTS); NUMERICAL MODELS; PRINTED CIRCUIT BOARDS; SOLDERING;

COMPACT THERMAL MODELING; CONSTANT HEAT FLUX; DERIVED FUNCTIONS; EXTERNAL RESISTANCE; INTERNAL FEATURES; OPERATING CONDITION; THERMAL PERFORMANCE; THERMAL RESISTANCE NETWORKS;

HEAT RESISTANCE;

EID: 84964577852     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/EPTC.2002.1185688     Document Type: Conference Paper

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