Development of effective compact models for depopulated ball grid array packages

Proceedings of the Electronic Packaging Technology Conference, EPTC

Volumn 2000-January, Issue , 2000, Pages 131-137

  Loh, C V ^a   Toh, K C ^a   Pinjala, D ^b   Iyer, M K ^b  

^a NANYANG TECHNOLOGICAL UNIVERSITY   (Singapore)

^b INSTITUTE OF MICROELECTRONICS   (Singapore)

Author keywords

Computational fluid dynamics; Electrical resistance measurement; Electronics packaging; Finite element methods; Performance analysis; Plastics; Testing; Thermal conductivity; Thermal resistance; Vehicles

Indexed keywords

BALL GRID ARRAYS; COMPUTATIONAL FLUID DYNAMICS; ELECTRONICS PACKAGING; HEAT RESISTANCE; PLASTICS; SOLDERED JOINTS; SOLDERING; TESTING; THERMAL CONDUCTIVITY; THERMAL CONDUCTIVITY OF LIQUIDS; VEHICLES;

BALL GRID ARRAY PACKAGES; CONSTRICTION RESISTANCE; ELECTRICAL RESISTANCE MEASUREMENT; ENHANCED BALL GRID ARRAY; EQUIVALENT THERMAL CONDUCTIVITIES; FINITE ELEMENT PROGRAMS; PERFORMANCE ANALYSIS; PLASTIC BALL GRID ARRAYS;

FINITE ELEMENT METHOD;

EID: 50049090781     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/EPTC.2000.906361     Document Type: Conference Paper

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