A study of the thermal characterization of a high - Performance flip chip package

2008 11th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, I-THERM

Volumn , Issue , 2008, Pages 302-309

  Bhopte, Siddharth ^a   Sammakia, Bahgat ^a   Calmidi, Varaprasad ^b  

^a BINGHAMTON UNIVERSITY   (United States)

^b Endicott Interconnect Technologies Inc   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRONICS ENGINEERING; FATIGUE OF MATERIALS; FIGHTER AIRCRAFT; FLIP CHIP DEVICES; FORMING; LUBRICATING GREASES; MILITARY OPERATIONS; NUMERICAL ANALYSIS; THERMAL EFFECTS; THERMAL INSULATING MATERIALS; THERMOCOUPLES; THERMOMECHANICAL TREATMENT; THERMOMETERS;

FLIP-CHIP PACKAGING; PARAMETRIC STUDIES;

NUMERICAL METHODS;

EID: 50949096310     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ITHERM.2008.4544284     Document Type: Conference Paper

References (8)

1. th International Symposium on Microelectronics, November 16-20, Boston, MA, USA
2. st ASME National Heat Transfer Conference, HTD Volume 309, pp 83-94
3. "Thermal Characterization of IC Packages", Application Note 4083, http://www.maxim-ic.com/
4. K.K Sikka, "Advanced Thermal Tester for Accurate Measurement of Internal Thermal Resistance of High Power Electronic Modules" ITHERM 2000, The 7th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, Vol. 2, pp 208-212
5. th IEEE SEMITHERM .
6. V.V. Calmidi, "Thermal Performance of a Thin High Interconnect Density Organic Substrate for Flip-Chip Applications" ECTC 2005, Electronic Components and Technology Conference, 31May-3 June 2005, pp. 1728 - 1734 Vol. 2
7. V.V. Calmidi and I. Memis, "Thermal Enhancement of Systems using Organic Flip Chip Packages (FC-PBGA) with an Alternate Cooling Path through the Printed Wiring Board", ECTC 2006, Electronic Components and Technology Conference, 30 May-2 June 2006
8. IcePak 6.2 User Manual