Surface roughness reduction in nanocrystalline Cu thin films by electrical stressing treatment

Applied Physics Letters

Volumn 98, Issue 18, 2011, Pages

  Chan, Tsung Cheng ^a   Chen, Kuan Chia ^a   Liao, Chien Neng ^a  

^a NATIONAL TSING HUA UNIVERSITY   (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

CU FILMS; CU METALLIZATION; CU(1 1 1); HIGH-DENSITY; MORPHOLOGICAL EVOLUTION; NANOCRYSTALLINE CU; POST THERMAL TREATMENT;

METALLIC FILMS; SURFACE PROPERTIES; SURFACE ROUGHNESS; THIN FILMS;

COPPER;

EID: 79957526651     PISSN: 00036951     EISSN: None     Source Type: Journal    
DOI: 10.1063/1.3586772     Document Type: Article

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