Basic thermo-mechanical property estimation of a 3D-crosslinked epoxy/SiO2 interface using molecular modelling

Microelectronics Reliability

Volumn 51, Issue 6, 2011, Pages 1027-1034

  Holck O ^a   Dermitzaki, E ^a   Wunderle, B ^a,b   Bauer, J ^a   Michel, B ^a  

^a Fraunhofer Institute Reliability and Microintegration   (Germany)

^b CHEMNITZ UNIVERSITY OF TECHNOLOGY   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

COMPOUND MATERIAL; CROSSLINKED; GENERAL TRENDS; HOLISTIC APPROACH; MATERIALS DEVELOPMENT; MATERIALS FAILURE; MODEL PACKAGE; MOLECULAR DYNAMICS SIMULATIONS; MOLECULAR MODELLING; MULTI METHODS; NANOSCALE LEVELS; PRACTICAL METHOD; RELIABILITY ASSESSMENTS; SIMULATION PACKAGES; SIMULATION TECHNIQUE; THERMOMECHANICAL PROPERTIES;

INTERFACES (MATERIALS); MECHANICAL PROPERTIES; MOLDING; MOLECULAR DYNAMICS; MOLECULAR MODELING; PACKAGING MATERIALS; RELIABILITY ANALYSIS; THREE DIMENSIONAL;

FAILURE ANALYSIS;

EID: 79955888205     PISSN: 00262714     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.microrel.2011.03.014     Document Type: Conference Paper

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