Interdiffusion and barrier layer formation in thermally evaporated Mn/Cu heterostructures on SiO2 substrates

Applied Physics Letters

Volumn 98, Issue 12, 2011, Pages

  Lozano, J G ^a,b   Lozano Perez, S ^b   Bogan, J ^a   Wang, Y C ^c   Brennan, B ^a   Nellist, P D ^b   Hughes, G ^a  

^a DUBLIN CITY UNIVERSITY   (Ireland)

^b UNIVERSITY OF OXFORD   (United Kingdom)

^c Thermo Fisher Scientific   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

BARRIER LAYERS; CHEMICAL COMPOSITIONS; CU LAYERS; ENERGY DISPERSIVE X RAY SPECTROSCOPY; HETEROSTRUCTURES; INTER-DIFFUSION; INTERFACIAL LAYER;

CRYSTALS; ENERGY DISSIPATION; MANGANESE; SILICON COMPOUNDS; SURFACE STRUCTURE; TRANSMISSION ELECTRON MICROSCOPY; X RAY SPECTROSCOPY;

ELECTRON ENERGY LOSS SPECTROSCOPY;

EID: 79953869868     PISSN: 00036951     EISSN: None     Source Type: Journal    
DOI: 10.1063/1.3569146     Document Type: Article

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