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Volumn 36, Issue 1-2, 2001, Pages 153-160
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The interdiffusion of Sn from AuSn solder with the barrier metal deposited on diamond
a
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Author keywords
A. Multilayers; A. Thin films; B. Sputtering
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Indexed keywords
ANNEALING;
DIAMONDS;
GOLD ALLOYS;
INTERDIFFUSION (SOLIDS);
ION BEAM ASSISTED DEPOSITION;
METALLIZING;
RUTHERFORD BACKSCATTERING SPECTROSCOPY;
SPUTTER DEPOSITION;
SUBSTRATES;
THERMODYNAMIC STABILITY;
TIN;
BARRIER METALS;
SOLDERING ALLOYS;
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EID: 0035047415
PISSN: 00255408
EISSN: None
Source Type: Journal
DOI: 10.1016/S0025-5408(00)00478-5 Document Type: Article |
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Times cited : (5)
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References (16)
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