Design of practical liquid metal cooling device for heat dissipation of high performance CPUs

Journal of Electronic Packaging

Volumn 132, Issue 3, 2010, Pages

  Deng, Yueguang ^a   Liu, Jing ^a  

^a TECHNICAL INSTITUTE OF PHYSICS AND CHEMISTRY   (China)

Author keywords

chip cooling; electromagnetic pump; heat transfer enhancement; high performance CPUs; liquid metal cooling; thermal management

Indexed keywords

CHANNEL FLOW; ELECTRONIC COOLING; ENERGY CONSERVATION; GALLIUM ALLOYS; HEAT FLUX; LIQUID METALS; METALS; OPTOELECTRONIC DEVICES; PROGRAM PROCESSORS;

CHIP COOLING; COOLING CAPABILITY; COOLING DEVICES; HEAT TRANSFER ENHANCEMENT; HIGH HEAT FLUX; HIGH PERFORMANCE CPU; HIGH-POWER DENSITY ELECTRONICS; LIQUID METAL COOLING; PERFORMANCE; WATER COOLING;

COOLANTS;

EID: 79953234032     PISSN: 10437398     EISSN: 15289044     Source Type: Journal    
DOI: 10.1115/1.4002012     Document Type: Article

References (20)

1. Bar-Cohen, A., Arik, M., and Ohadi, M., 2006, "Direct Liquid Cooling of High Flux Micro and Nano Electronic Components," Proc. IEEE, 94, pp. 1549-1570. (Pubitemid 46432335)
2. Kim, K. S., Won, M. H., Kim, J. W., and Back, B. J., 2003, "Heat Pipe Cooling Technology for Desktop PC CPU," Appl. Therm. Eng., 23, pp. 1137-1144.
3. Ivanova, M., Avenas, Y., Schaeffer, C., Dezord, J. B., and Schulz-Harder, J., 2006, "Heat Pipe Integrated in Direct Bonded Copper DBC Technology for Cooling of Power Electronics Packaging," IEEE Trans. Power Electron., 21, pp. 1541-1547. (Pubitemid 44824198)
4. Morini, G. L., 2004, "Single-Phase Convective Heat Transfer in Microchannels: A Review of Experimental Results," Int. J. Therm. Sci., 43, pp. 631-651.
5. Lee, D. Y., and Vafai, K., 1999, "Comparative Analysis of Jet Impingement and Microchannel Cooling for High Heat Flux Applications," Int. J. Heat Mass Transfer, 42, pp. 1555-1568. (Pubitemid 29216358)
6. Chau, S. W., Lin, C. H., Yeh, C. H., and Yang, C., 2007, "Study on the Cooling Enhancement of LED Heat Sources via an Electrohydrodynamic Approach," Thirty-Third Annual Conference of the IEEE Industrial Electronics Society, IEEE, New York, pp. 2934-2937.
7. Chowdhury, I., Prasher, R., Lofgreen, K., Chrysler, G., Narasimhan, S., Mahajan, R., Koester, D., Alley, R., and Venkatasubramanian, R., 2009, "On-Chip Cooling by Superlattice-Based Thin-Film Thermoelectrics," Nat. Nanotechnol., 4, pp. 235-238.
8. Nguyen, C. T., Roy, G., Gauthier, C., and Galanis, N., 2007, "Heat Transfer Enhancement Using Al2O3-Water Nanofluid for an Electronic Liquid Cooling System," Appl. Therm. Eng., 27, pp. 1501-1506. (Pubitemid 46187157)
9. Chamarthy, P., and Utturkar, Y., 2009, "Theoretical Evaluation and Experimental Investigation of Microencapsulated Phase Change Materials MPCM in Electronics Cooling Applications," Twenty-Fifth Annual IEEE Semiconductor Thermal Measurement and Management Symposium, IEEE, New York, pp. 239-245.
10. Acikalin, T., Garimella, S. V., Petroski, J., and Raman, A., 2004, "Optimal Design of Miniature Piezoelectric Fans for Cooling Light Emitting Diodes," Ninth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, IEEE, New York, pp. 663-671.
11. Ma, K. Q., and Liu, J., 2007, "Liquid Metal Cooling in Thermal Management of Computer Chips," Front. Energy Power Eng. China, 1, pp. 384-402.
12. Miner, A., and Ghoshal, U., 2004, "Cooling of High-Power-Density Microdevices Using Liquid Metal Coolants," Appl. Phys. Lett., 85, pp. 506-508.
13. Ma, K. Q., and Liu, J., 2007, "Heat-Driven Liquid Metal Cooling Device for the Thermal Management of a Computer Chip," J. Phys. D, 40, pp. 4722- 4729. (Pubitemid 47160511)
14. Ma, K. Q., and Liu, J., 2007, "Nano Liquid-Metal Fluid as Ultimate Coolant," Phys. Lett. A, 361, pp. 252-256. (Pubitemid 44855320)
15. Silverman, I., Yarin, A. L., Reznik, S. N., Arenshtam, A., Kijet, D., and Nagler, A., 2006, "High Heat-Flux Accelerator Targets: Cooling With Liquid Metal Jet Impingement," Int. J. Heat Mass Transfer, 49, pp. 2782-2792. (Pubitemid 43902848)
16. Ghoshal, U., Grimm, D., Ibrani, S., Johnston, C., and Miner, A., 2005, "High- Performance Liquid Metal Cooling Loops," Twenty-First Annual IEEE Semiconductor Thermal Measurement and Management Symposium, IEEE, New York, pp. 16-19. (Pubitemid 41696249)
17. Yang, S. M., and Tao, W. Q., 1998, Heat Transfer, Higher Education, Beijing, China, in Chinese.
18. Upadhya, G., Munch, M., Zhou, P., Hom, J., Werner, D., and McMaster, M., 2006, "Micro-Scale Liquid Cooling System for High Heat Flux Processor Cooling Applications," Twenty-Second Annual IEEE Semiconductor Thermal Measurement and Management Symposium, IEEE, New York, pp. 116-119. (Pubitemid 44592070)
19. Kang, S., Miller, D., and Cennamo, J., 2007, "Closed Loop Liquid Cooling for High Performance Computer Systems," IPACK 2007: Proceedings of the ASME Interpack Conference 2007, ASME, New York, pp. 509-515. (Pubitemid 351352543)
20. Deng, Y. G., Liu, J., and Zhou, Y. X., 2009, "Liquid Metal Based Mini/Micro Channel Cooling Devices," Seventh International ASME Conference on Nanochannels, Microchannels and Minichannels, ASME, Pohang.