Liquid metal based mini/micro channel cooling device

Proceedings of the 7th International Conference on Nanochannels, Microchannels, and Minichannels 2009, ICNMM2009

Volumn , Issue PART A, 2009, Pages 253-259

  Deng, Yue Guang ^a   Liu, Jing ^a   Zhou, Yi Xin ^a  

^a TECHNICAL INSTITUTE OF PHYSICS AND CHEMISTRY   (China)

Author keywords

[No Author keywords available]

Indexed keywords

CONVECTIVE HEAT TRANSFER COEFFICIENT; COOLING CAPABILITY; COOLING DEVICES; COOLING EFFECTS; COOLING FLUIDS; ENERGY SAVING; ENGINEERING FIELDS; HEAT DISSIPATION; HEAT DISSIPATION RATES; HEAT TRANSFER THEORY; HIGH VELOCITY; LOW MELTING POINT; MICRO-CHANNEL DEVICES; MINI/MICRO-CHANNEL; PUMP POWER; THERMAL RESISTANCE; VOLUME FLOW; WORKING FLUID;

COOLANTS; COOLING; ENERGY CONSERVATION; HEAT EXCHANGERS; HEAT TRANSFER COEFFICIENTS; LIQUID METALS; METAL WORKING; METALS; MICROCHANNELS; PUMPS; SMELTING;

FLUIDS;

EID: 77952920153     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1115/ICNMM2009-82046     Document Type: Conference Paper

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