Heat pipe integrated in direct bonded copper (DBC) technology for cooling of power electronics packaging

IEEE Transactions on Power Electronics

Volumn 21, Issue 6, 2006, Pages 1541-1547

  Ivanova, Mariya ^a   Avenas, Yvan ^a   Schaeffer, Christian ^a   Dezord, Jean Bernard ^b   Schulz Harder, Juergen ^c  

^a ENSIEG   (France)

^b THALES ALENIA SPACE   (France)

^c Curamik Electronics GmbH   (Germany)

Author keywords

Direct bonded copper (DBC); Electronic cooling; Heat pipe; Space application; Thermal experiments

Indexed keywords

COOLING SYSTEMS; ELECTRONICS PACKAGING; HEAT FLUX; HEAT PIPES; THERMAL CONDUCTIVITY;

DIRECT BONDED COPPER; ELECTRONIC COOLING; HEAT SOURCE;

POWER ELECTRONICS;

EID: 37849189749     PISSN: 08858993     EISSN: None     Source Type: Journal    
DOI: 10.1109/TPEL.2006.882974     Document Type: Article

References (8)

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