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Volumn 97, Issue , 2009, Pages 129-139

Full-wave modeling of multiple vias using differential signaling and shared antipad in multilayered high speed vertical interconnects

Author keywords

[No Author keywords available]

Indexed keywords

ITERATIVE METHODS;

EID: 70350627060     PISSN: 10704698     EISSN: 15598985     Source Type: Journal    
DOI: 10.2528/PIER09091707     Document Type: Article
Times cited : (36)

References (16)
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    • (2009) Journal of Electromagnetic Waves and Applications , vol.23 , pp. 729-735
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  • 3
    • 0035813539 scopus 로고    scopus 로고
    • Modeling of multiple scattering among vias in planar waveguides using Foldy-Lax equations
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  • 5
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    • Modeling multiple vias with arbitrary shape of antipads and pads in high speed interconnect circuits
    • Wu, B. and L. Tsang, Modeling multiple vias with arbitrary shape of antipads and pads in high speed interconnect circuits, IEEE Microw. Wireless Compon. Lett., Vol. 19, 12-14, 2009.
    • (2009) IEEE Microw. Wireless Compon. Lett. , vol.19 , pp. 12-14
    • Wu, B.1    Tsang, L.2
  • 6
    • 77952011680 scopus 로고    scopus 로고
    • Signal integrity analysis of package and printed circuit board with multiple vias in substrate of layered dielectrics
    • in press
    • Wu, B. and L. Tsang, Signal integrity analysis of package and printed circuit board with multiple vias in substrate of layered dielectrics, IEEE Trans. Adv. Packag., in press, 2009.
    • (2009) IEEE Trans. Adv. Packag.
    • Wu, B.1    Tsang, L.2
  • 7
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    • Novel methods for modeling of multiple vias in multilayered parallel-plate structures
    • Liu, E.-X., E.-P. Li, Z. Z. Oo, X. Wei, Y. Zhang, and R. Vahldieck, "Novel methods for modeling of multiple vias in multilayered parallel-plate structures," IEEE Trans. Microw. Theory Tech., Vol. 57, 1724-1733, 2009.
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    • Liu, E.-X.1    Li, E.-P.2    Oo, Z.Z.3    Wei, X.4    Zhang, Y.5    Vahldieck, R.6
  • 8
    • 70350682264 scopus 로고    scopus 로고
    • UWEE Via Tool. Ver. 2.21, University of Washington, Seattle, WA, Jul. 2009, [Online] Available
    • UWEE Via Tool. Ver. 2.21, Laboratory of Applications and Computations in Electromagnetics and Optics, University of Washington, Seattle, WA, Jul. 2009, [Online] Available: www.ee.washington.edu/research/laceo/Via_Tool/.
    • Laboratory of Applications and Computations in Electromagnetics and Optics
  • 9
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  • 11
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    • Signal integrity analysis for 3D high-speed interconnects using Foldy-Lax multiple scattering equations
    • 640, Beijing, China, March 23-27
    • Wu, B. and L. Tsang, Signal integrity analysis for 3D high-speed interconnects using Foldy-Lax multiple scattering equations, Progress In Electromagnetics Research Symposium Abstracts, 640, Beijing, China, March 23-27, 2009.
    • (2009) Progress In Electromagnetics Research Symposium Abstracts
    • Wu, B.1    Tsang, L.2
  • 13
    • 70350642310 scopus 로고    scopus 로고
    • TM, Ver. 3.5, Ansoft Corporation, Pittsburgh, PA, Dec. 2008, [Online] Available
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  • 14
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    • Multiple scattering among vias in lossy planar waveguides using SMCG method
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  • 15
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* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.