Electrochemical corrosion behaviour of Sn-8Zn-3Bi-XCr solder in 3.5% NaCl

2009 International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2009

Volumn , Issue , 2009, Pages 701-707

  Jing, Hu ^a   Anmin, Hu ^a   Ming, Li ^a   Dali, Mao ^a  

^a SHANGHAI JIAO TONG UNIVERSITY   (China)

Author keywords

[No Author keywords available]

Indexed keywords

3.5%NACL; AGING TIME; CORROSION POTENTIALS; CR ATOMS; ENERGY DISPERSIVE X-RAY SPECTROSCOPY; LONG-TERM AGING; OXIDE LAYER; PASSIVE FILMS; POLARIZATION STUDY; RESISTANCE PROPERTIES; SEM; SN-8ZN-3BI; SN-ZN-BI; SOLDER ALLOYS; SOLDER CORROSION; X RAY DIFFRACTOMETERS;

ALLOYS; CHROMIUM; CORROSION RATE; CORROSION RESISTANCE; CORROSIVE EFFECTS; ELECTROCHEMICAL CORROSION; ELECTRONICS PACKAGING; ENERGY DISPERSIVE SPECTROSCOPY; PACKAGING; PASSIVATION; POLARIZATION; SCANNING ELECTRON MICROSCOPY; SODIUM CHLORIDE; SOLDERING ALLOYS; TIN ALLOYS; X RAY DIFFRACTION; X RAY SPECTROSCOPY; ZINC;

TIN;

EID: 70449812932     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ICEPT.2009.5270657     Document Type: Conference Paper

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