Examining the environmental impact of lead-free soldering alternatives

IEEE Transactions on Electronics Packaging Manufacturing

Volumn 24, Issue 1, 2001, Pages 4-9

  Turbini, Laura J ^a,b   Munie, Gregory C ^c   Bernier, Dennis ^d   Gamalski, Jürgen ^e   Bergman, David W ^f  

^a IEEE   (Canada)

^b Centre for Microelectronics Assembly and Packaging   (Canada)

^c NOKIA RESEARCH CENTER   (United States)

^d Kester Solder   (United States)

^e SIEMENS AG   (Germany)

^f IPC   (United States)

Author keywords

Industrial ecology; Lead free soldering; WEEE

Indexed keywords

LEAD-FREE SOLDERING;

ECOLOGY; ENVIRONMENTAL IMPACT; INDUSTRIAL WASTES; SOLDERING ALLOYS; WASTE UTILIZATION;

SOLDERING;

EID: 0034954270     PISSN: 1521334X     EISSN: None     Source Type: Journal    
DOI: 10.1109/6104.924786     Document Type: Article

References (35)

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4. Junked PC's a growing environmental problem
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6. Impact of higher melting lead-free solders on reliability of printed wiring assemblies
7. Method 1311 Toxicity Characteristic Leaching Procedure (TPLP)
8. Are lead-free solders really environmentally friendly?
9. Environmental impact of lead-free solders
10. The environmental threats of discarded picture tubes and printed circuit boards
11. Damage claims fly over cyanide spill