Seedless copper electroplating on Ta from a "single" electrolytic bath

Electrochimica Acta

Volumn 55, Issue 5, 2010, Pages 1656-1663

  Starosvetsky, David ^a   Sezin, Nina ^a   Ein Eli, Yair ^a  

^a TECHNION ISRAEL INSTITUTE OF TECHNOLOGY   (Israel)

Author keywords

Electroplating; Oxide removal; Seedless copper; Single bath; Ta barrier

Indexed keywords

ALTERNATIVE APPROACH; APPLIED POTENTIALS; COPPER ELECTRODEPOSITION; COPPER ELECTROPLATING; COPPER LAYER; ELECTROCHEMICAL BATH; ELECTROLYTIC BATHS; NEGATIVE POTENTIAL; NUCLEATION AND GROWTH; OXIDE REMOVAL; SHORT PERIODS; SINGLE BATH; TWO-STEP PROCESS;

COPPER; COPPER PLATING; ELECTROPLATING;

TANTALUM;

EID: 74549185880     PISSN: 00134686     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.electacta.2009.10.044     Document Type: Article

References (18)

1. Kim S., and Duquette D. J. Electrochem. Soc. 154 (2007) D195
2. Zheng M., Kelly J.J., and Deligianni H. J. Electrochem. Soc. 154 (2007) D400
3. Hui Hsu H., Chan Hsieh C., Hsian Chen M., Jein Lin S., and Wei Yeh J. J. Electrochem. Soc. 148 (2001) C590
4. Wang Z., Li H., Shodiev H., and Ivar Suni I. Electrochem. Solid-State Lett. 8 (2005) G283
5. Radisic A., Cao Y., Taephaisitphongse P., West A., and Searson P.C. J. Electrochem. Soc. 148 (2001) C41
6. Radisic A., Cao Y., Taephaisitphongse P., West A., and Searson P.C. J. Electrochem. Soc. 151 (2004) C369
7. M. Pourbaix, Atlas of Electrochemical Equilibria in Aqueous Solutions, chapter IV, section 09.3 - Tantalum.
8. In: Shreier L.L. (Ed). Corrosion (1995), Newness-Butterworth, London
9. Bard A.J. Encyclopedia of Electrochemistry of the Elements vol. 2 (1976), Marcel Dekker Inc. (chapter 3 - Tantalum)
10. Sapra S., Li H., Wang Z., and Suni I.I. J. Electrochem. Soc. 152 (2005) B193
11. Zhang J., Li S., and Carter P.W. J. Electrochem. Soc. 154 (2007) H109
12. Vermilyea D.A. J. Electrochem. Soc. 102 (1955) 655
13. Tench D., and Ogden C. J. Electrochem. Soc. 125 (1978) 194
14. Ogden C., and Tench D. J. Electrochem. Soc. 128 (1981) 539
15. Magagnin L., Maboudian R., and Carraro C. Thin Solid Films 434 (2003) 100
16. ASTM International Standards B571-97 (2003), Standard Practice for Qualitative Adhesion Testing of Metallic Coatings, Paints and Coatings, American Society for Testing and Materials (ASTM).
17. Moffat T.P., Walker M., Chen P.J., Bonevich J.E., and Egelhoff W.F. J. Electrochem. Soc. 153 (2006) C37
18. Konno H., and Nagayama M. Electrochim. Acta 23 (1978) 1001