Quantitative stress/strain mapping during micropillar compression

Philosophical Magazine

Volumn 91, Issue 7-9, 2011, Pages 1097-1107

  Maeder, X ^a   Mook, W M ^a   Niederberger, C ^a   Michler, J ^a  

^a SWISS FEDERAL LABORATORIES FOR MATERIALS SCIENCE AND TECHNOLOGY   (Switzerland)

Author keywords

compression; EBSD; in situ electron microscopy; stress strain measurements

Indexed keywords

COMPRESSION; CROSS CORRELATION TECHNIQUES; DATA ANALYSIS; EBSD; ELASTIC STRAIN; ELECTRON BACK SCATTER DIFFRACTION; FLAT SURFACES; GAAS; HIGH SPATIAL RESOLUTION; HIGH-RESOLUTION SCANNING ELECTRON MICROSCOPES; IN-SITU; IN-SITU ELECTRON MICROSCOPY; LENGTH SCALE; LOAD-DISPLACEMENT DATA; MAXIMUM LOAD; MICRO PILLARS; MICRO-MECHANICAL TESTING; MICRO-SCALES; NANOINDENTERS; SHEAR COMPONENTS; STRAIN GRADIENTS; STRAIN SENSITIVITY; STRAIN TENSOR; STRESS AND STRAIN; STRESS TENSORS; STRESS-STRAIN MEASUREMENT; STRESS/STRAIN; SUBMICRON SCALE; UNI-AXIAL COMPRESSION; VON MISES STRESS;

COMPACTION; DATA COMPRESSION; DATA REDUCTION; ELECTRONS; MAPPING; MATERIALS TESTING; MECHANICAL PROPERTIES; MECHANICAL TESTING; NANOINDENTATION; SCANNING ELECTRON MICROSCOPY; STRAIN GAGES; STRAIN MEASUREMENT; STRESS-STRAIN CURVES; TENSORS;

STRAIN;

EID: 79952653942     PISSN: 14786435     EISSN: 14786443     Source Type: Journal    
DOI: 10.1080/14786435.2010.505178     Document Type: Article

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