Comparison of medium-vacuum and plasma-activated low-temperature wafer bonding

Applied Physics Letters

Volumn 88, Issue 11, 2006, Pages

  Tan, Cher Ming ^a   Yu, Weibo ^a   Wei, Jun ^a  

^a NANYANG TECHNOLOGICAL UNIVERSITY   (Singapore)

Author keywords

[No Author keywords available]

Indexed keywords

ANNEALING; LOW TEMPERATURE EFFECTS; PLASMA APPLICATIONS; VACUUM APPLICATIONS;

LOW-TEMPERATURE ANNEALING; MEDIUM-VACUUM LEVEL WAFER BONDING (MVWB);

BONDING;

EID: 33645132642     PISSN: 00036951     EISSN: None     Source Type: Journal    
DOI: 10.1063/1.2185467     Document Type: Article

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