Effect of Bi addition on shear strength of Sn-3Ag-0.5Cu/Cu solder joints

Jinshu Xuebao/Acta Metallurgica Sinica

Volumn 44, Issue 4, 2008, Pages 473-477

  Zhao, Jie ^a   Chi, Chengyu ^a   Cheng, Congqian ^a  

^a DALIAN UNIVERSITY OF TECHNOLOGY   (China)

Author keywords

Fracture; Shear strength; Sn 3Ag 0.5Cu Bi; Solder

Indexed keywords

BRITTLE FRACTURE; COPPER ALLOYS; DUCTILE FRACTURE; INTERMETALLICS; SHEAR STRENGTH; SILVER ALLOYS; SOLDERING ALLOYS; TIN ALLOYS;

SOLDER JOINTS;

SOLDERED JOINTS;

EID: 45449103302     PISSN: 04121961     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

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