메뉴 건너뛰기




Volumn , Issue , 2010, Pages

A novel approach to simulate Fin-width Line Edge Roughness effect of FinFET performance

Author keywords

3 D numerical simulation; Fin width LER; FinFETs; Intrinsic parameter fluctuation

Indexed keywords

3-D NUMERICAL SIMULATION; FIN-WIDTH LER; FINFETS; INTRINSIC PARAMETER FLUCTUATION; LINE EDGE ROUGHNESS; LOW DRAIN VOLTAGES; MATLAB PROGRAM; SHIFT-AND; SIMULATION EXPERIMENTS; SIMULATION RESULT; STATISTICAL SIMULATION; VELOCITY SATURATION EFFECT;

EID: 79952516165     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/EDSSC.2010.5713678     Document Type: Conference Paper
Times cited : (2)

References (8)
  • 2
    • 0442326805 scopus 로고    scopus 로고
    • A simulation study of gate line edge roughness effects on doping profiles of short-channel MOSFET devices
    • Feb.
    • S. Xiong, and I. Bokor, "A simulation study of gate line edge roughness effects on doping profiles of short-channel MOSFET devices," Vol. 51, No.2, IEEE Trans. Electron Devices, Feb. 2004, pp. 228-232.
    • (2004) IEEE Trans. Electron Devices , vol.51 , Issue.2 , pp. 228-232
    • Xiong, S.1    Bokor, I.2
  • 3
    • 0036928972 scopus 로고    scopus 로고
    • Determination of the line edge roughness specification for 34 nm devices
    • T. Linton, M. Chandhok, B. I. Rice, and G. Schrom, "Determination of the line edge roughness specification for 34 nm devices," in IEDM Tech. Dig., 2002, pp. 303-306.
    • (2002) IEDM Tech. Dig. , pp. 303-306
    • Linton, T.1    Chandhok, M.2    Rice, B.I.3    Schrom, G.4
  • 4
    • 60649101907 scopus 로고    scopus 로고
    • 3-D simulation of geometrical variations impact on nanoscale FinFETs
    • ICSICT 2008. 9th International Conference on 20-23 Oct.
    • Shimeng Yu, Yuning Zhao, Yuncheng Song, Gang Du, Jinfeng Kang, Ruqi Han, and Xiaoyan Liu, "3-D simulation of geometrical variations impact on nanoscale FinFETs," Solid-State and Integrated-Circuit Technology, 2008. ICSICT 2008. 9th International Conference on 20-23 Oct. 2008, pp. 408-411.
    • (2008) Solid-state and Integrated-circuit Technology, 2008 , pp. 408-411
    • Yu, S.1    Zhao, Y.2    Song, Y.3    Du, G.4    Kang, J.5    Han, R.6    Liu, X.7
  • 6
    • 44049092378 scopus 로고    scopus 로고
    • Impact of LER and random dopant fluctuations on FinFET matching performance
    • DOI 10.1109/TNANO.2008.917838, 4445642
    • Emanuele Baravelli, Malgorzata Jurczak, Nicol'o Speciale, Kristin De Meyer, and Abhisek Dixit, "Impact of LER and Random Dopant Fluctuations on FinFET Matching Performance," Vol. 7, No. 3, IEEE Transactions on nanotechnology, MAY 2008, pp. 291 - 298. (Pubitemid 351711248)
    • (2008) IEEE Transactions on Nanotechnology , vol.7 , Issue.3 , pp. 291-298
    • Baravelli, E.1    Jurczak, M.2    Speciale, N.3    De Meyer, K.4    Dixit, A.5
  • 7
    • 0042532317 scopus 로고    scopus 로고
    • Intrinsic parameter fluctuations in decananometer MOSFETs introduced by gate line edge roughness
    • Member, IEEE MAY
    • Asen Asenov, Member, IEEE, Savas Kaya, and Andrew R. Brown, "Intrinsic Parameter Fluctuations in Decananometer MOSFETs Introduced by Gate Line Edge Roughness," Vol. 50, No. 5, IEEE Trans. Electron Devices, MAY 2003, pp. 1254 - 1260
    • (2003) IEEE Trans. Electron Devices , vol.50 , Issue.5 , pp. 1254-1260
    • Asenov, A.1    Kaya, S.2    Brown, A.R.3
  • 8
    • 79952507592 scopus 로고    scopus 로고
    • TCAD 3-D numerical simulator: A package of software in process, device and circuit simulations from integrated system engineering (ISE)
    • TCAD 3-D numerical simulator: A package of software in process, device and circuit simulations from Integrated System Engineering (ISE). DESSIS is the tool for multi-dimensional device simulations.
    • DESSIS Is the Tool for Multi-dimensional Device Simulations


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.