Thermal boundary resistance of copper phthalocyanine-metal interface

Applied Physics Letters

Volumn 98, Issue 9, 2011, Pages

  Jin, Y ^a   Yadav, A ^a   Sun, K ^a   Sun, H ^a   Pipe, K P ^a   Shtein, M ^a  

^a UNIVERSITY OF MICHIGAN   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COPPER PHTHALOCYANINE; HEAT CARRIERS; HEAT TRANSFER PROCESS; INORGANIC MATERIALS; INTERFACE DENSITY; METAL INTERFACE; MULTI-LAYER THIN FILM; THERMAL BOUNDARY RESISTANCE; THERMAL MANAGEMENT; VACUUM THERMAL EVAPORATION; WEAK BONDING;

DISSIMILAR MATERIALS; ENERGY CONVERSION; FILM PREPARATION; MULTILAYER FILMS; MULTILAYERS; NITROGEN COMPOUNDS; SILVER; THERMAL CONDUCTIVITY; THERMAL CONDUCTIVITY OF SOLIDS; THERMOELECTRIC ENERGY CONVERSION; VACUUM EVAPORATION;

THERMAL EVAPORATION;

EID: 79952419541     PISSN: 00036951     EISSN: None     Source Type: Journal    
DOI: 10.1063/1.3555449     Document Type: Article

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