Electroplating of copper in the presence of 5,6-dihydropyrimidine-2-(1h)-thione, 2-methylthiopyrimidine-4-(1h)-one, 2-thiopyrimidine-4-(1h)-ones, and 2,4-pyrimidine(1h,3h)-dione derivatives as organic additives

Journal of Dispersion Science and Technology

Volumn 32, Issue 3, 2011, Pages 453-463

  Ahmed, Abdel Monem M ^a   Abdel Rahman, Adel A H ^b   El Adl, Ahmed F ^b  

^a Alexandria University Faculty Of Science   (Egypt)

^b Menoufia University   (Egypt)

Author keywords

Corrosion inhibition; Electrodeposition; Limiting current; Mass transfer; Thiopyrimidines

Indexed keywords

COPPER CATHODES; CORROSION INHIBITION; DIFFUSION CONTROLLED; ELECTRODE PROCESS; ELECTROPLATING REACTIONS; INHIBITION EFFICIENCY; LIMITING CURRENT; MASS TRANSFER CORRELATION; ORGANIC ADDITIVES; THIOPYRIMIDINE; THIOPYRIMIDINES;

ACTIVATION ENERGY; COPPER; CORROSION PREVENTION; ELECTRODEPOSITION; MASS TRANSFER;

ADDITIVES;

EID: 79951873243     PISSN: 01932691     EISSN: 15322351     Source Type: Journal    
DOI: 10.1080/01932690903232279     Document Type: Article

References (38)

1. Ricq, L., Lallemand, F., Gigandet, M.P., and Pagetti, J. (2001) Surf. Coat. Technol., 138: 278.
2. Lallemand, F., Ricq, L., and Ricq, M. (2004) Surf. Coat. Technol., 179: 314.
3. Rashwan, S.M., Mohamed, A.E., and Abdel-Wahaab, S.M. (2002) J. Electrochem. Soc., 47: 4149.
4. Gomes, A. and da Silva Pereira, M.I. (2006) Electrochim. Acta, 51: 1342.
5. Chassaing, E. (2001) J. Electrochem. Soc., 148: C690.
6. Bouyaghroumni, A. and Versaud, P. (1996) Can. Metall. Q., 35: 245.
7. Huang, C.H. (1993) Metal. Finish., 91: 107.
8. Ahmed, A.M. and Zourab, Sh.M., (1988) Z. Mettalikde, 74: 476.
9. Issa, I.M., Ghoneim, M.M., El-Samahy, A.A., and Tharwat, M. (1972) Electrochim. Acta, 17: 1251.
10. Ahmed, A.M. and Mohamed, B.G. (1989) J. Electrochem. Soc. India, 38: 1
11. Vivian Feng, Z. and Gewirth, A.A. (2007) J. Electroanalytical Chem., 601: 242.
12. Ahmed, A.M. and Faid-Allah, H.M. (1987) Bull. Electrochem., 3: 225
13. Ahmed, A.M. (1989) Bull. Electrochem., 5: 212.
14. Zaher, M.A. and Ahmed, A.M. (1988) XIV Internat Carbohydr. Symp., August 14, 19.
15. Ahmed, A.M., Ahmed, E.A., El-Bardan, A.A., and Saad, E.F. (1989) Alex. Eng. J. Univ., 28 (2): 577.
16. Saad, E.F., Hamed, E.A., El-Bardan, A.A., Moussa, A.M., and Ahmed, A.M. (1991) Bull. Electrochem., 7: 87.
17. Andricacos, P.C., Uzoh, C., Dukovic, J.O., Horkans, J., and Deligianni, H. (1998) IBM J. Res. Develop., 42: 567.
18. Schlesinger, M. and Paunovic, M. (Eds.) (2000) Modern Electroplating; New York: John Wiley.
19. Cotton, J.B. and Scholes, J. (1967) Br. Corros. J., 2: 5
20. Babic, R., Metikos-Hukovic, M. (2000) Thin Solid Films, 359: 88
21. Magnussen, O.M. and Behm, R.J. (1999) MRS Bull., 24: 16.
22. Tan, M. and Harb, J.N. (2003) J. Electrochem. Soc., 150: 420
23. Kang, M., Gewirth, A.A. (2003) J. Electrochem. Soc., 150: 426
24. Dow, W.P. and Huang, H.S. (2003) Z. Electrochem. Solid-State Lett., 6: 134
25. Chiu, S.Y., Shieh, J.M., Chang, S.C., Lin, K.C., Dai, B.T., and Chen, C.F. (2000) J. Vac. Sci. Technol. B, 18: 2835.
26. Brown, T.H., Blakemore, R.C., Durant, G.J., Emmett, J.C., Ganellin, C.R., Parson, M.E., Rawlings, D.A., and Walker, T.F. (1988) Eur. J. Med. Chem., 23: 53.
27. Schmidt, J.G. (1880) Ber. Dtsch. Chem. Ges., 13: 2342
28. Claisen, L. and Claparede, A. (1981) Ber. Dtsch. Chem. Ges., 14: 349
29. Kohler, E.P. and Chadwell, H.M. (1922) Org. Synth., 2: 1.
30. Arab, S.T. and Noor, E.A. (1993) Corrosion, 49: 2
31. Jansen, L.J.J. and Hoogland, J.G. (1973) Electrochim. Acta, 18: 543.
32. Wilke, C.R., Eisenberg, M., and Tobias, C.W. (1953) J. Electrochem. Soc., 100: 513.
33. Sedahmed, G.H. (1987) J. Appl. Electrochem., 17: 746.
34. Abd El-Rehim, S.S., Sayyah, S.M., and El-Deeb, M.M. (2000) Appl. Surf. Sci., 165: 249.
35. Taha, A.A., Sallam, S.H., and Ahmed, A.M. (1994) Anti-Corros. Methods Mater., 41: 10.
36. Ahmed, A.M. and Shehata, M.Z. (1988) Z. Metallkd., 74: 476
37. Ahmed, A.M., Hamed, E.A., El-Bardan, A.A., and Saad, F.A. (1989) Alex. Eng. J., 26: 578.
38. Ahmed, A.-M.M., Abdel-Rahman, A.A.-H., and El Adl, A.F. (2010) J. Dispersion Sci. Technol., 31: 243-252.