Atomic force microscopic study of polymeric film growth in copper electroplating bath with benzotriazole

Journal of Electroanalytical Chemistry

Volumn 601, Issue 1-2, 2007, Pages 242-250

  Feng, Z Vivian ^a   Gewirth, Andrew A ^a  

^a UNIVERSITY OF ILLINOIS AT URBANA CHAMPAIGN   (United States)

Author keywords

AFM; Benzotriazole; Film growth

Indexed keywords

ATOMIC FORCE MICROSCOPY; DIFFUSION; ELECTROPLATING; FILM GROWTH; SURFACE PHENOMENA; SURFACE ROUGHNESS;

ACIDIC SOLUTION; BENZOTRIAZOLE; COPPER ELECTROPLATING; POLYMERIC FILMS;

AROMATIC POLYMERS;

EID: 33847329103     PISSN: 15726657     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.jelechem.2006.11.012     Document Type: Article

References (35)

1. Andricacos P.C., Uzoh C., Dukovic J.O., Horkans J., and Deligianni H. IBM J. Res. Develop. 42 (1998) 567
2. In: Schlesinger M., and Paunovic M. (Eds). Modern Electroplating (2000), John Wiley & Sons, Inc., New York
3. Cotton J.B., and Scholes I.R. Br. Corros. J. 2 (1967) 5
4. Babic R., and Metikos-Hukovic M. Thin Solid Films 359 (2000) 88
5. Magnussen O.M., and Behm R.J. MRS Bull. 24 (1999) 16
6. Vogt M.R., Nichols R.J., Magnussen O.M., and Behm R.J. J. Phys. Chem. B 102 (1998) 5859
7. Polewska W., Vogt M.R., Magnussen O.M., and Behm R.J. J. Phys. Chem. B 103 (1999) 10440
8. Magnussen O.M., Vogt M.R., Scherer J., and Behm R.J. Appl. Phys. A - Mater. Sci. Proc. A66 (1998) S447
9. Vogt M.R., Polewska W., Magnussen O.M., and Behm R.J. J. Electrochem. Soc. 144 (1997) L113
10. Ling Y., Guan Y., and Han K.N. Corros. Sci. 51 (1995) 367
11. Ogle I.C.G., and Poling G.W. Can. Metall. Quart. 14 (1975) 37
12. Dai X., Zhang Y., Guan Y., Yang S., and Xu J. Thin Solid Films 474 (2005) 159
13. Hansma P.K., Cleveland J.P., Radmacher M., Walters D.A., Hilner P.E., Bezanilla M., Fritz M., Vie D., Hansma H.J., Prater C.B., Massie J., Fukunaga L., Gurley J., and Eilings V. Appl. Phys. Lett. 64 (1994) 1738
14. Resch R., Friedbacher G., and Grasserbauer M. Fresen. J. Anal. Chem. 358 (1997) 352
15. Zhong Q., Inniss D., Kjoller K., and Elings V.B. Surf. Sci. Lett. 290 (1993) L688
16. Knoll A., Magerle R., and Krausch G. Macromolecules 34 (2001) 4159
17. Quate C.F. Surf. Sci. 299/300 (1994) 980
18. Kasas S., Thomson N.H., Smith B.L., Hansma H.G., Zhu X., Guthold M., Bustamante C., Kool E.T., Kashlev M., and Hansma P.K. Biochemistry 36 (1997) 461
19. Revenko I., and Proksch R. J. Appl. Phys. 87 (2000) 526
20. Leung T.Y.B., Kang M., Corry B.F., and Gewirth A.A. J. Electrochem. Soc. 147 (2000) 3326
21. Poling G.W. Corros. Sci. 10 (1970) 359
22. Biggin M.E., and Gewirth A.A. J. Electrochem. Soc. 148 (2001) C339
23. Schultz Z.D., Biggin M.E., White J.O., and Gewirth A.A. Anal. Chem. 76 (2004) 604
24. Cao P.G., Yao J.L., Zheng J.W., Gu R.A., and Tian Z.Q. Langmuir 18 (2002) 100
25. Polewska W., Vogt M.R., Magnussen O.M., and Behm R.J. Proc. SPIE 4413 (2001) 233
26. Hepel M., and Cateforis E. Electrochim. Acta 46 (2001) 3801
27. Heakal F.E., and Haruyama S. Corros. Sci. 20 (1980) 887
28. Brusic V., Frisch M.A., Eldridge B.N., Kaufman F.B., Petersen T.A., Schrott A., and Frankel G.S. Revue de Metallurgie/Cahiers d'Informations Techniques 90 (1993) 1631
29. Brusic V., Frisch M.A., Eldridge B.N., Novak F.P., Kaufman F.B., Rush B.M., and Frankel G.S. J. Electrochem. Soc. 138 (1991) 2253
30. Mansfeld F., Smith T., and Parry E.P. Corrosion 27 (1971) 289
31. Mansikkamaeki K., Ahonen P., Fabricius G., Murtomaki L., and Kontturi K. J. Electrochem. Soc. 152 (2005) B12
32. Modestov A.D., Zhou G.-D., Wu Y.-P., Notoya T., and Schweinsberg D.P. Corros. Sci. 11 (1994)
33. Venables J.A. Introduction to Surface and Thin Film Processes (2000), University Press, Cambridge
34. Tromans D., and Sun R.-H. J. Electrochem. Soc. 138 (1991) 3235
35. Schmidt W.U., Alkire R.C., and Gewirth A.A. J. Electrochem. Soc. 143 (1996) 3122