|
Volumn 8, Issue 2, 2011, Pages 546-548
|
Study on fabrication method of forming-free resistance random access memory
|
Author keywords
Forming; NiO; Reset current; Resistive random access memory (ReRAM)
|
Indexed keywords
BOTTOM ELECTRODES;
FABRICATION METHOD;
FORMING PROCESS;
GUIDING PRINCIPLES;
HIGH-RESISTANCE STATE;
INITIAL STATE;
IV CHARACTERISTICS;
LOW-RESISTANCE STATE;
MEMORY CELL;
MEMORY LAYERS;
NIO;
RESET CURRENT;
RESET CURRENTS;
RESISTANCE CHANGE EFFECTS;
RESISTANCE RANDOM ACCESS MEMORY;
RESISTIVE RANDOM ACCESS MEMORY;
SOFT BREAKDOWN;
TOTAL RESISTANCE;
TRANSITION-METAL OXIDES;
NONVOLATILE STORAGE;
OXYGEN;
OXYGEN VACANCIES;
REACTIVE ION ETCHING;
SEMICONDUCTOR STORAGE;
TRANSITION METAL COMPOUNDS;
TRANSITION METALS;
RANDOM ACCESS STORAGE;
|
EID: 79951704474
PISSN: 18626351
EISSN: 16101642
Source Type: Journal
DOI: 10.1002/pssc.201000600 Document Type: Article |
Times cited : (11)
|
References (10)
|