-
1
-
-
0036493244
-
Illumination with solid state lighting technology
-
Steigerwald D A, Bhat J C, Collins D, et al. Illumination with solid state lighting technology. IEEE J Sel Topics Quantum Electron, 2002, 8: 310
-
(2002)
IEEE J Sel Topics Quantum Electron
, vol.8
, pp. 310
-
-
Steigerwald, D.A.1
Bhat, J.C.2
Collins, D.3
-
2
-
-
0036983576
-
Thermal challenges facing new generation light emitting diodes (LEDs) for lighting applications
-
Petroski J. Thermal challenges facing new generation light emitting diodes (LEDs) for lighting applications. SPIE Proceeding, 2002: 215
-
(2002)
SPIE Proceeding
, pp. 215
-
-
Petroski, J.1
-
3
-
-
1842689139
-
Thermal management of LEDs: Package to system
-
Arik M, Becker C, Weaver S, et al. Thermal management of LEDs: package to system. Third International Conference on Solid State Lighting, 2004, 5187: 64
-
(2004)
Third International Conference on Solid State Lighting
, vol.5187
, pp. 64
-
-
Arik, M.1
Becker, C.2
Weaver, S.3
-
4
-
-
33646724491
-
High power LED arrays special requirements on packaging technology
-
Kuückmann O. High power LED arrays special requirements on packaging technology. SPIE Proceeding, 2006, 6134: 32
-
(2006)
SPIE Proceeding
, vol.6134
, pp. 32
-
-
Kuückmann, O.1
-
6
-
-
50949095140
-
Comparison of thermal performances of plate-fin and pin-fin heat sinks subject to an impinging flow
-
Kim D K, Bae J K, Kim S J. Comparison of thermal performances of plate-fin and pin-fin heat sinks subject to an impinging flow. ITHERM, 2008: 360
-
(2008)
ITHERM
, pp. 360
-
-
Kim, D.K.1
Bae, J.K.2
Kim, S.J.3
-
7
-
-
0038818522
-
Least-material optimization of vertical pin-finplate-fin, and triangular-fin heat sinks in natural convective heat transfer
-
Iyengar M, Bar-Cohen A. Least-material optimization of vertical pin-finplate-fin, and triangular-fin heat sinks in natural convective heat transfer. IEEE Trans Compon Packag Technol, 2003, 26: 62
-
(2003)
IEEE Trans Compon Packag Technol
, vol.26
, pp. 62
-
-
Iyengar, M.1
Bar-Cohen, A.2
-
8
-
-
0038587604
-
Carbon foams for thermal management
-
Gallego N C, Klett J W. Carbon foams for thermal management. Carbon, 2004, 41: 1461
-
(2004)
Carbon
, vol.41
, pp. 1461
-
-
Gallego, N.C.1
Klett, J.W.2
-
9
-
-
37849189749
-
Heat pipe integrated in direct bonded copper (DBC) technology for cooling of power electronics packaging
-
Ivanova M, Avenas Y, Schaeffer C, et al. Heat pipe integrated in direct bonded copper (DBC) technology for cooling of power electronics packaging. IEEE Trans Power Electron, 2006, 21: 1541
-
(2006)
IEEE Trans Power Electron
, vol.21
, pp. 1541
-
-
Ivanova, M.1
Avenas, Y.2
Schaeffer, C.3
-
10
-
-
0001294535
-
Thermal control of electronic equipment by heat pipes
-
Groll M, Schneider M, Sartre V, et al. Thermal control of electronic equipment by heat pipes. Revue Générale de Thermique, 1998, 37: 323
-
(1998)
Revue Générale de Thermique
, vol.37
, pp. 323
-
-
Groll, M.1
Schneider, M.2
Sartre, V.3
-
11
-
-
0001435905
-
Anomalously increased effective thermal conductivities of ethylene glycol-based nanofluids containing copper nanoparticles
-
Eastman J A, Choi S U S, Li S, et al. Anomalously increased effective thermal conductivities of ethylene glycol-based nanofluids containing copper nanoparticles. Appl Phys Lett, 2001, 78: 1341218
-
(2001)
Appl Phys Lett
, vol.78
, pp. 1341218
-
-
Eastman, J.A.1
Choi, S.U.S.2
Li, S.3
-
13
-
-
67650729730
-
Thermal analysis of loop heat pipe used for high-power LED
-
Lu X Y, Hua T C, Liu M J, et al. Thermal analysis of loop heat pipe used for high-power LED. Thermochimica Acta, 2009, 493: 25
-
(2009)
Thermochimica Acta
, vol.493
, pp. 25
-
-
Lu, X.Y.1
Hua, T.C.2
Liu, M.J.3
-
14
-
-
33847326175
-
Thermal analysis of LED array system with heat pipe
-
Kim L, Choi J H, Jang S H, et al. Thermal analysis of LED array system with heat pipe. Thermochimica Acta, 2007, 455: 21
-
(2007)
Thermochimica Acta
, vol.455
, pp. 21
-
-
Kim, L.1
Choi, J.H.2
Jang, S.H.3
-
15
-
-
0038015833
-
Fabrication and experimental investigation of silicon micro heat pipes for cooling electronics
-
Le Berre M, Launay S, Sartre V, et al. Fabrication and experimental investigation of silicon micro heat pipes for cooling electronics. Micromechan Microeng, 2003, 13: 436
-
(2003)
Micromechan Microeng
, vol.13
, pp. 436
-
-
Le Berre, M.1
Launay, S.2
Sartre, V.3
-
17
-
-
0038180861
-
An overview of thermal management for next generation microelectronic devices
-
Tonapi S S, Fillion R A, Schattenmann F J, et al. An overview of thermal management for next generation microelectronic devices. SEMI, 2003: 250
-
(2003)
SEMI
, pp. 250
-
-
Tonapi, S.S.1
Fillion, R.A.2
Schattenmann, F.J.3
-
18
-
-
15744402976
-
Emerging low cost LED thermal management materials
-
Zweben C. Emerging low cost LED thermal management materials. SPIE Proceeding, 2004: 194
-
(2004)
SPIE Proceeding
, pp. 194
-
-
Zweben, C.1
-
19
-
-
33947312728
-
Nanoscale thermal transport and microrefrigerators on a chip
-
Shakouri A. Nanoscale thermal transport and microrefrigerators on a chip. IEEE Proceeding, 2006, 94: 1613
-
(2006)
IEEE Proceeding
, vol.94
, pp. 1613
-
-
Shakouri, A.1
-
20
-
-
42349113188
-
Extremely high thermal conductivity of graphene: Prospects for thermal management applications in nanoelectronic circuits
-
Ghosh S, Calizo I, Teweldebrhan D, et al. Extremely high thermal conductivity of graphene: prospects for thermal management applications in nanoelectronic circuits. Appl Phys Lett, 2008, 92: 151911
-
(2008)
Appl Phys Lett
, vol.92
, pp. 151911
-
-
Ghosh, S.1
Calizo, I.2
Teweldebrhan, D.3
|