Emerging low cost LED thermal management materials

Proceedings of SPIE - The International Society for Optical Engineering

Volumn 5530, Issue , 2004, Pages 194-206

  Zweben, Carl ^a  

^a Adv Packaging Materials Consultant   (United States)

Author keywords

Carbon; Coefficient of thermal expansion; Composites; Graphite; Light emitting diodes; Manufacturing; Materials; Packaging; Thermal conductivity; Thermal management; Thermal stresses

Indexed keywords

ALUMINUM ALLOYS; CARBON NANOTUBES; COMPOSITE MATERIALS; COSTS; ELECTRONICS PACKAGING; GRAPHITE; SERVERS; SILICON CARBIDE; TELECOMMUNICATION SYSTEMS; THERMAL CONDUCTIVITY; THERMAL EXPANSION; THERMAL STRESS;

CARBON MATRIX COMPOSITES; COEFFICIENT OF THERMAL EXPANSION; GRAPHITE NANOPLATES; THERMAL MANAGEMENT MATERIALS;

LIGHT EMITTING DIODES;

EID: 15744402976     PISSN: 0277786X     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1117/12.563934     Document Type: Conference Paper

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