Low profile-high performance vapor chamber heat sinks for cooling high-density blade servers

Annual IEEE Semiconductor Thermal Measurement and Management Symposium

Volumn , Issue , 2007, Pages 174-178

  Wu, Xiao Ping ^a   Mochizuki, Masataka ^a   Nguyen, Thang ^a   Saito, Yuji ^a   Wuttijumnong, Vijit ^a   Ghisoiu, Horia ^a   Kumthonkittikul, Vichan ^a   Sukkasaem, Parichart ^a   Nimitkiatklai, Pichit ^a   Kiyooka, F ^a  

^a Fujikura America Inc   (United States)

Author keywords

Heat sink; High density server; Innovation; Low profile; Spreading thermal resistance; Vapor chamber

Indexed keywords

COOLING; HEAT LOSSES; HEAT RESISTANCE; MACHINE DESIGN; MICROPROCESSOR CHIPS; OPTIMIZATION;

HIGH DENSITY SERVERS; SPREADING THERMAL RESISTANCE; VAPOR CHAMBERS;

HEAT SINKS;

EID: 34548070201     PISSN: 10652221     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/STHERM.2007.352419     Document Type: Conference Paper

References (4)

1. Sourced by http://www 03.ibm.com/systems/bladecenter/bladeh/index.html
2. Xiao P.Wu, M. Mochizuki, Y. Saito, T. Nguyen, V. Wuttijumnong and D. Wu, Analyzing and Modeling on Optimized L-Ratio of Evaporator Section to Condenser Section for Micro Heat Pipe Heat Sinks, Semiconductor Thermal Measurement and Management Symposium, March 11-13 2003, San Jose, CA USA.
3. th International Heat Pipe Conference, September 21-25, 2004, Shanghai, China.
4. Song, S., Lee, Sl, and Au, V., 1994, "Closed-Form Equation for Thermal Constriction/Spreading Resistances with Variable Resistance Boundary Condition," Proceedings of the 1994 International Electronics Packaging Conference, Atlanta, Georgia, PP. 111-121.