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Journal of Materials Science

Volumn 46, Issue 8, 2011, Pages 2467-2473

Intermetallic phase formation in diffusion-bonded Cu/Al laminates

(5) Guo, Yajie a Liu, Guiwu a Jin, Haiyun a Shi, Zhongqi a Qiao, Guanjun a

a XI'AN JIAOTONG UNIVERSITY (China)

Author keywords

[No Author keywords available]

Indexed keywords

APPARENT ACTIVATION ENERGY; CU LAYERS; EFFECTIVE HEAT OF FORMATION; INTERMETALLIC LAYER; INTERMETALLIC PHASE; INTERMETALLIC PHASIS; PARABOLIC LAW; PLASMA ACTIVATED SINTERING; TEMPERATURE RANGE; THERMODYNAMIC DRIVING FORCES; TIME AND TEMPERATURE DEPENDENCE; VOLUME DIFFUSION;

ACTIVATION ENERGY; DIFFUSION; INTERMETALLICS; SINTERING; SOLDERING ALLOYS; TEMPERATURE; THERMOCHEMISTRY;

ALUMINUM;

EID: 79751523909 PISSN: 00222461 EISSN: 15734803 Source Type: Journal
DOI: 10.1007/s10853-010-5093-0 Document Type: Article

Times cited : (192)

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