Effect of annealing on the interfacial structure of aluminum-copper joints

Materials Transactions

Volumn 48, Issue 7, 2007, Pages 1938-1947

  Chen, Chih Yuan ^a   Hwang, Weng Sing ^a  

^a NATIONAL CHENG KUNG UNIVERSITY   (Taiwan)

Author keywords

Bimetal; Cold roll bonding; Intermetallic compound

Indexed keywords

ACTIVATION ENERGY; ANNEALING; BIMETALS; CRACK PROPAGATION; INTERMETALLICS; SCANNING ELECTRON MICROSCOPY; SURFACE STRUCTURE;

COLD ROLL BONDING; INTERMETALLIC LAYERS; MULTILAYERS INTERDIFFUSION;

JOINTS (STRUCTURAL COMPONENTS);

EID: 34548042746     PISSN: 13459678     EISSN: None     Source Type: Journal    
DOI: 10.2320/matertrans.MER2006371     Document Type: Conference Paper

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