Effect of rolling temperature on interface and bond strength development of roll bonded copper/aluminium metal laminates

Journal of Materials Science

Volumn 34, Issue 2, 1999, Pages 277-281

  Peng, X K ^a   Heness, G ^a   Yeung, W Y ^a  

^a UNIVERSITY OF TECHNOLOGY SYDNEY   (Australia)

Author keywords

[No Author keywords available]

Indexed keywords

METAL LAMINATES;

ALUMINUM; BIMETALS; BOND STRENGTH (MATERIALS); COPPER; DIFFUSION IN SOLIDS; DISSOLUTION; INTERFACES (MATERIALS); INTERMETALLICS; ROLL BONDING; SINTERING; THERMAL EFFECTS;

LAMINATES;

EID: 0032636524     PISSN: 00222461     EISSN: None     Source Type: Journal    
DOI: 10.1023/A:1004497304095     Document Type: Article

References (13)

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