Growth of intermetallic layer in multi-laminated Ti/Al diffusion couples

Materials Science and Engineering: A

Volumn 435-436, Issue , 2006, Pages 638-647

  Xu, L ^a   Cui, Y Y ^a   Hao, Y L ^a   Yang, R ^a  

^a INSTITUTE OF METAL RESEARCH   (China)

Author keywords

Growth behavior; Phase prediction; Ti Al diffusion couples; TiAl3 layer

Indexed keywords

ACTIVATION ENERGY; ALUMINUM; DIFFUSION IN SOLIDS; GRAIN BOUNDARIES; KINETIC THEORY; LAMINATES; THERMAL EFFECTS; TITANIUM;

LOW-TEMPERATURE KINETICS; PHASE PREDICTION; SOLID-STATE REACTIVE DIFFUSION;

INTERMETALLICS;

ACTIVATION ENERGY; ALUMINUM; DIFFUSION IN SOLIDS; GRAIN BOUNDARIES; INTERMETALLICS; KINETIC THEORY; LAMINATES; THERMAL EFFECTS; TITANIUM;

EID: 33749062992     PISSN: 09215093     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.msea.2006.07.077     Document Type: Article

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