Intermetallic formation in the aluminum-copper system

Surface Review and Letters

Volumn 10, Issue 4, 2003, Pages 677-683

  Hannech, E B ^a   Lamoudi, N ^a   Benslim, N ^a   Makhloufi, B ^a  

^a BADJI MOKHTAR UNIVERSITY   (Algeria)

Author keywords

Al Cu system; Growth kinetics; Interdiffusion; Intermetallics

Indexed keywords

ALUMINUM ALLOYS; DIFFUSION; PHASE DIAGRAMS; SCANNING ELECTRON MICROSCOPY;

DIFFUSION COUPLES;

INTERMETALLICS;

ALUMINUM DERIVATIVE; COPPER DERIVATIVE;

ARTICLE; DIFFUSION; METAL BINDING; PHASE TRANSITION; PREDICTION; SCANNING ELECTRON MICROSCOPY; SOLID;

EID: 0041836098     PISSN: 0218625X     EISSN: None     Source Type: Journal    
DOI: 10.1142/S0218625X03005396     Document Type: Article

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