Grinding damage of BK7 using copper-resin bond coarse-grained diamond wheel

International Journal of Precision Engineering and Manufacturing

Volumn 12, Issue 1, 2011, Pages 5-13

  Zhao, Qingliang ^a   Chen, Junyun ^a   Huang, Haitao ^b   Fang, Xiaoyan ^b  

^a HARBIN INSTITUTE OF TECHNOLOGY   (China)

^b Shanghai Machine Tool Works   (China)

Author keywords

Coarse grained diamond wheel; Copper resin bond wheel; Grinding; Optical glass BK7; Surface and subsurface damage

Indexed keywords

EID: 79751478190     PISSN: 12298557     EISSN: None     Source Type: Journal    
DOI: 10.1007/s12541-011-0001-3     Document Type: Article

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