Experimental investigation of surface/subsurface damage formation and material removal mechanisms in SiC grinding

International Journal of Machine Tools and Manufacture

Volumn 48, Issue 6, 2008, Pages 698-710

  Agarwal, Sanjay ^a   Rao, P Venkateswara ^a  

^a INDIAN INSTITUTE OF TECHNOLOGY DELHI   (India)

Author keywords

Ceramics; Grinding; SiC; Surface integrity

Indexed keywords

CERAMIC MATERIALS; DAMAGE DETECTION; SCANNING ELECTRON MICROSCOPY; SURFACE ROUGHNESS;

MACHINING INDUCED DAMAGE; MATERIAL REMOVAL; SUBSURFACE DAMAGE; SURFACE INTEGRITY;

SILICON CARBIDE;

EID: 39749151614     PISSN: 08906955     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.ijmachtools.2007.10.013     Document Type: Article

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