Preparation and thermal analysis of Sn-Ag nano solders

Materials Transactions

Volumn 51, Issue 12, 2010, Pages 2145-2149

  Bao, Tran Thai ^a   Kim, Yunkyum ^a   Lee, Joonho ^a,b   Lee, Jung Goo ^b  

^a Korea University   (South Korea)

^b Korea Institute of Material Science   (South Korea)

Author keywords

Arc discharge process; Differential scanning calorimetry; Nano solder; Phase diagram; Tin silver alloy

Indexed keywords

ARC-DISCHARGE PROCESS; AVERAGE SIZE; ENERGY DISPERSIVE X RAY SPECTROSCOPY; LARGE PARTICLES; NANO SOLDER; SEM; TEM; THERMAL ANALYSIS;

CALORIMETERS; DIFFERENTIAL SCANNING CALORIMETRY; MELTING POINT; PHASE DIAGRAMS; SCANNING; SCANNING ELECTRON MICROSCOPY; SILVER; SILVER ALLOYS; SOLDERING ALLOYS; THERMOANALYSIS; TIN ALLOYS; TRANSMISSION ELECTRON MICROSCOPY; X RAY DIFFRACTION; X RAY SPECTROSCOPY;

TIN;

EID: 79551665236     PISSN: 13459678     EISSN: None     Source Type: Journal    
DOI: 10.2320/matertrans.MJ201013     Document Type: Article

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