Contour evolution and sliding behavior of molten Sn-Ag-Cu on tilting Cu and Al2O3 substrates

Colloids and Surfaces A: Physicochemical and Engineering Aspects

Volumn 359, Issue 1-3, 2010, Pages 1-5

  Xu, Hongyan ^a,b,c   Yuan, Zhangfu ^a,b   Lee, Joonho ^d   Matsuura, Hiroyuki ^e   Tsukihashi, Fumitaka ^e  

^a INSTITUTE OF PROCESS ENGINEERING   (China)

^b PEKING UNIVERSITY   (China)

^c UNIVERSITY OF CHINESE ACADEMY OF SCIENCES   (China)

^d Korea University   (South Korea)

^e UNIVERSITY OF TOKYO   (Japan)

Author keywords

Contact angle; Contour evolution; Interaction; Sliding behavior; Tilting substrate

Indexed keywords

ALUMINUM; CONTACT ANGLE; END EFFECTORS; SILVER; TIN;

CONTACT POINTS; CONTACT TIME; CONTOUR EVOLUTION; CU SUBSTRATE; INTERACTION; REACTIVE LAYERS; RECEDING CONTACT; SN-AG-CU; SOLID SURFACE; TILTED ANGLE; WETTING BEHAVIOR;

SUBSTRATES;

ALUMINUM OXIDE; COPPER; SILVER; TIN;

CHEMICAL ANALYSIS; CONTACT ANGLE; PHASE TRANSITION; PHYSICAL CHEMISTRY; PRIORITY JOURNAL; REVIEW; TEMPERATURE SENSITIVITY; TILTING;

EID: 77549084079     PISSN: 09277757     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.colsurfa.2010.01.060     Document Type: Review

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