Effect of oxygen on surface tension of liquid Ag-Sn alloys

Materials Transactions

Volumn 45, Issue 3, 2004, Pages 625-629

  Lee, Joonho ^a   Tanaka, Toshihiro ^a   Yamamoto, Masaya ^a   Hara, Shigeta ^a  

^a OSAKA UNIVERSITY   (Japan)

Author keywords

Lead free soldering; Liquid silver tin alloys; Sessile drop method; Surface tension

Indexed keywords

ADSORPTION; PRESSURE EFFECTS; SOLDERING ALLOYS; SURFACE TENSION; THERMAL EFFECTS; THERMODYNAMICS; TIN ALLOYS;

LEAD-FREE SOLDERING; LIQUID SILVER-TIN ALLOYS; PARTIAL PRESSURE RANGE; SESSILE DROP METHOD;

SILVER ALLOYS;

EID: 2442508762     PISSN: 13459678     EISSN: None     Source Type: Journal    
DOI: 10.2320/matertrans.45.625     Document Type: Article

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