Revealing the nucleation and growth mechanism of a novel solder developed from Sn-3.5Ag-0.5Cu nanoparticles by a chemical reduction method

Journal of Electronic Materials

Volumn 35, Issue 9, 2006, Pages 1755-1760

  Hsiao, Li Yin ^a   Duh, Jenq Gong ^a  

^a NATIONAL TSING HUA UNIVERSITY   (Taiwan)

Author keywords

(Ag,Cu)3Sn; (Ag,Cu)4Sn; Nanoparticles; Sn 3.5Ag 0.5Cu

Indexed keywords

MICROSTRUCTURE; NUCLEATION; REDUCTION; SCANNING ELECTRON MICROSCOPY; SOLDERED JOINTS; SYNTHESIS (CHEMICAL); X RAY DIFFRACTION ANALYSIS;

PARTICLE GROWTH; POLYCRYSTALLINE PARTICLES;

NANOSTRUCTURED MATERIALS;

EID: 33749368244     PISSN: 03615235     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11664-006-0230-x     Document Type: Article

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