Clustering effects in plasma-assisted chemical fluid deposition of copper: Similarities between deposition rate and density fluctuation

Chemical Physics Letters

Volumn 502, Issue 4-6, 2011, Pages 173-175

  Ito, Tsuyohito ^a   Tamura, Tomoya ^a  

^a OSAKA UNIVERSITY   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

CHEMICAL FLUID DEPOSITION; CLUSTERING EFFECT; CONSTANT TEMPERATURE; COPPER FILMS; DENSITY FLUCTUATION; ENVIRONMENTAL PRESSURES; SILICON SUBSTRATES; SUPERCRITICAL CARBON DIOXIDES;

CARBON DIOXIDE; CARBON FILMS; COMPUTATIONAL FLUID DYNAMICS; DEPOSITION RATES; SUPERCRITICAL FLUID EXTRACTION;

PLASMA DEPOSITION;

EID: 78751643989     PISSN: 00092614     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.cplett.2010.12.038     Document Type: Article

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